High-Speed Test Access for Chiplets, CPC, and CPO: Die, Substrate, and Package-Level Solutions
Attendees of this webinar will learn how high-density, solderless electrical access supports characterization of processors, switches, and custom ASICs at die, substrate, and package levels. Increasing data rates leave less […]
Characterizing Front Panel I/O: Reliable Host and Module Testing for 1.6T and 3.2T Systems
As datacenter systems scale toward 1.6T and 3.2T architectures, front panel I/O is becoming a more critical point for electrical characterization. Higher lane rates increase sensitivity to breakout geometry, transition […]
Explore Quick-Turn TR Series Options with the New TR Multicoax Configurator
Amphenol Ardent Concepts has launched a new TR Multicoax Configurator to help customers review available quick-turn TR Series options and send in application details for follow-up. The configurator starts with […]
Enabling Scalable Backplane Connector Testing for 224G & 448G Datacenter Systems
As datacenter systems move to 224G and early 448G signaling, validating backplane connector performance is becoming increasingly critical both in design, as well as in rack deployment. High-speed backplane connectors […]
Enabling Reliable Electrical Characterization for 224G & 448G Optical Systems
As systems move to 224G and early 448G signaling, validating high-speed channels is becoming less about the device itself and more about how you access it. Even in optical architectures, […]