Amphenol Ardent Concepts Launches an Upgraded Website, Spotlighting Cutting-Edge Connectivity Solutions for Engineers
Amphenol Ardent Concepts is dedicated to leading the way in interconnectivity solutions within unique and challenging environments, including on your display. Amphenol Ardent Concepts, a leading provider of high-performance interconnect
Amphenol Ardent Concepts Introduces Low-Profile Right Angle Configurations in TR90™ Multicoax Series
New Configurations Build Upon Amphenol Ardents’ TR Multicoax Series 20/40/70 GHZ Configurations for use in 112G/224G, 5G/6G, and Automotive Radar Applications Amphenol Ardent Concepts, a pioneering leader in advanced connector
Amphenol Ardent Concepts Releases High-Density TR90™ Multicoax Connector for Semiconductor, Test & Measurement, Mobile Communication, and Automotive Sector E-Band Designs
TR90 Builds Upon Amphenol Ardents’ TR Multicoax Series 20/40/70 GHZ Configurations for use in 112G/224G, 5G/6G, and Automotive Radar Applications Hampton, New Hampshire – Amphenol Ardent Concepts, a leading provider
Ardent Concepts, Inc. Releases High-Density Ganged Coaxial Attenuators to Support Scale up of Cryogenic and Quantum Computing Applications
Thermalized low noise cryogenic attenuators mate seamlessly with Amphenol Ardent Concepts’ TR Multicoax™ connectors Ardent’s 16 channel Ganged Coaxial Attenuator is 94% more compact than 16 traditional SMA-style attenuators and
Amphenol Ardent Concepts and PHY-SI LLC Released QSFP DD 800G and OSFP 800G Form-Factor Host Compliance Test Fixtures with Access to all Lanes and Targeting IEEE 802.3ck CEI 112G-VSR Specification
Amphenol Ardent Concepts has released QSFP DD 800G (p/n PHI-SI-QSFP-DD-HCB-A4-32-2) and OSFP 800G (p/n PHI-SI-OSFP-HCB-A4-32-2) Host Compliance Test Fixtures (HCTF) for 800G system and component development in technical collaboration with
Amphenol Ardent Concepts Releases micro-LinkOVER™ as a Featured Near-Chip/On-Package Termination in Amphenol’s OverPass™ Series of PCB Trace Bypass Connectors
“We leveraged our experience designing and building reliable signal integrity connectors with compression mount technology in the near chip connector world to provide a connector capable of supporting current and upcoming 56G and 112G designs and beyond as customers think ahead towards 224G.”
BAE Systems Awards Amphenol Ardent Concepts 2020 Gold Tier Supplier Award
HAMPTON, N.H. MAY 21, 2020 Amphenol Ardent Concepts is proud to announce receiving a Gold Tier Supplier status with BAE Systems. This coveted honor, part of BAE Systems’ Partner 2
Amphenol Ardent Concepts Releases New Low-Profile Right Angle 16-Channel Multicoax Connector
16-Channel Form-Factor Allows System Designers to Escape Signals up to 70 GHz from Existing Standard Footprint Symbol Amphenol Ardent Concepts has released a new form factor of its TR Multicoax
MultiLane Chooses Amphenol Ardent Concepts for 400G Module Compliance Boards
MultiLane and Amphenol Ardent Concepts are teaming up to provide 400G QSFP-DD and OSFP low-cost, consumable MCBs for manufacturing testing. MultiLane’s module compliance boards are fully featured, CMIS compliant and