Engineers in test environments are focused on sockets that offer high performance at a reasonable cost. Ardent’s patented compression mount contact technology which utilizes industry‐leading alloys makes for a cost-effective and electrically robust socket solution. With designs supporting pitches down to 0.4mm and speeds up to 40 GHz, Ardent sockets are being used in cutting edge BGA, LGA and other small form factor IC applications. With cycle lives of thousands of mating cycles, the electrical reliability & performance of our sockets can meet the most demanding application needs.
BGA/LGA
- Validation and characterization of ASIC, FPGA, switch chip, SoC and other high speed device types
- Validation and characterization of RF and wireless devices
- Up to 40GHz repeatable performance with Spring Probes and Connect-R contact sets
- Up to 90GHz repeatable performance with elastometric option
- Contact factory for product specifications and performance capabilities
QFN/QFP/MEMS
- Up to 33GHz performance for both bench and production tests
- 0.4mm minimum pitch
- Scrub-R(TM) tungsten pin with hard gold plating for extended durability
- Ready-to-use socket design templates for both off-the-shelf as well as custom package types
Aerospace
- Seamless transition and consistent performance from prototyping and EM stages to qualification and flight
- Eliminates concern of solder joint fatigue due to vibration, thermal cycling, and radiation
- Proven contact technology ensures reliability of socket through harshest ground, launch, and flight environments
- Optimized material usage for low outgassing, weight, and RF performance at Ka/Ku band, and integration with system level components
- Mixed pitch customization capability that can be utilized to maximize signal integrity of critical Tx/Rx signals
- Contact factory for product specifications and performance capabilities
Cryogenic
- Suitable for quantum computing, cryogenic, and high vacuum applications
- Custom material option for clean / bake-out, thermal grounding, CTE matching, etc.
- Consistent and low contact resistance
- Contact factory for product specifications and performance capabilities
Optical Sockets
- Low loss connection for optical engines, modulators, transmitters, receivers, and other optical devices
- Ideal for 400G and 800G development
- Designed to accommodate fiber escape
- Flexibility in thermal management options
- Contact factory for product specifications and performance capabilities
Ardent Contact Portfolio
Contact Factory
Ardent Contact Portfolio
Specifications | RC-04-04 RC Springprobe™ | RC05-01 RC Springprobe™ | RC08-02 RC Springprobe™ | RC10-07 RC Springprobe™ | RC10-04 RC Springprobe™ | RC12-06 RC Springprobe™ | CR08-062 RC Connect-R™ |
Contact Material | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper |
Mated Height (in/mm) | 0.030/0.76 | 0.030/0.76 | 0.045/1.14 | 0.055/1.40 | 0.085/2.16 | 0.90/2.29 | .062/1.57 |
Minimum Pitch (in/mm) | 0.0157/0.40 | 0.0197/0.50 | 0.0315/0.80 | 0.0394/1.00 | 0.0394/1.00 | 0.0500/1.27 | 0.0315/0.80 |
Compression Force / Contact (gram ± 20%) | 20 | 20 | 20 | 24 | 22 | 34 | 60 |
Compression Range (in/mm) | 0.006/0.15 | 0.006/0.15 | 0.009/0.23 | 0.10/0.25 | 0.015/0.38 | 0.015/0.38 | 0.010/0.25 |
Contact Resistance (mΩ) | 60 | 70 | 60 | 50 | 66 | 65 | 50 |
Self-Inductance (nH) | ~.50 | 0.45 | 0.73 | 0.92 | 1.35 | ~1.50 | 0.61 |
High Freq Capacity (-1 dB point, GHz) | ~20 | 25 | 20 | 37 | 11 | ~20 | 40 (@1mm Pitch) |
Characteristics Impedance at Native Pitch (Ohms) | 56 | 65 | 61 | 73 | – | – | 57 (@1mm Pitch) |
Durability (Cycles) | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 1,000 |
Current Carrying Capacity (Single Contact at 30°C Temp Offset, Amps) | ~1 | ~1 | 1.8 | ~4 | 3.3 | 3.55 | ~2 |
Approximate Insertion Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (-dB) | N/A | GSG: 0.25/0.55/2.15 | GSG: 0.15/1.0/2.75 | GSG: 0.25/0.55/2.35 | N/A | N/A | GSG: 0.15/0.35/0.9 |
GSSG: 0.50/0.6/2.75 | GSSG: 1/1.5/2.5 | GSSG: 0.50/0.65/3.3 | GSSG: 0.85/1.6/1.35 | ||||
Approximate Return Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (-dB) | N/A | GSG: 16/10/6 | GSG: 20/10/6 | GSG: 0.25/0.55/2.35 | N/A | N/A | GSG: 24/15/10 |
GSSG: 14/13/5 | GSSG: 13/11/11 | GSSG: 0.50/0.65/3.3 | GSSG: 13/8/30 | ||||
Approximate Insertion Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (dB) | N/A | GSG: 0.1/0.15/1.0 | GSG: 0.2/1.65/2.65 | GSG: 0.15/2.4/1.2 | N/A | N/A | N/A |
GSSG: 0.2/0.55/1.2 | GSSG: 0.5/1/2.7 | GSSG: 0.25/2.4/1.2 | |||||
Approximate Return Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (dB) | N/A | GSG: 30/17/7 | GSG: 17/8/15 | GSG: 12/5/7 | N/A | N/A | N/A |
GSSG: 22/17/10 | GSSG: 17/10/8 | GSSG: 12/5/7 |
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