Case Studies

High density RF and high speed TR Multicoax™ Series Read Full Study

A major IC manufacturer was developing server processors and needed a way to test high-speed IO signals for data rate and accuracy. Read Full Study

A major IC Manufacturer was developing a next generation chipset with multiple lanes of high speed SerDes for a highly integrated, scalable metro transport solution with reduced power, cost and

A major consumer product company was developing sub-system that required 40GHz+ signals to come off the board and out to instrumentation for functional testing of production units. Read Full Study

A Characterization Engineer needed an alternative to SMP Connectors for device characterization and design correlation – the device being tested is a Cross-Point Switch. Read Full Study

A major defense contractor needed a reliable, high speed (12 Gbps) connector solution that would allow them to easily replace or upgrade expensive Circuit Card Assemblies (CCAs). Read Full Study

A major global telecommunications company was developing their own custom Analog to Digital Converter (ADC) and was looking to replace traditional end launch connector solutions for getting high speed signals

A major defense contractor was developing a high speed transceiver and developed their own, custom IC substrate. Read Full Study

A major IC Manufacturer was developing a new PCIE device and needed a repeatable way to de-embed the signal losses on their compliance base boards (CBB) to allow them to

Engineers working on a test team at a major IC manufacturer were developing next gen, JESD204B standard data converters, Digital to Analog (DAC) and Analog to Digital (ADC) running at