Ardent’s CA Series™ high performance 32 GHz+ compression mount connectors & interposers offer exceptional signal integrity and high density for applications like high-speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.
Reliable under extreme conditions, CA Seriesâ„¢ connectors can stand up to the most demanding environmental factors. Custom configurations are available in a wide array of pitch, density, stack height, and orientation.
Low-Profile Board-To-Board Compression Mount
- Quick-turn automation loaded connectors utilizing Connect-R contact technology ideal for high volume OEM applications
- Small volumes machined or large volumes molded
- 40 GHz AC performance in a highly configurable design (1-2500 leads)
- Custom and off-the-shelf connectors available
- Fill the gap between expensive spring pin solutions and unreliable elastomeric contact sets
- No solder down
Tight Pitch Board-To-Board Compression Mount
- 32 GHz+
- No solder down
- Area array pitches from 0.4 mm and up
- Removable/reusable
- Highly configurable, any shape and size
- Low compression force
Coaxial RF
- 35 GHz-70GHz AC performance
- Connect-R pin (35GHz) for high-volume, SpringProbe pin (70GHz+) for precision RF signal transmission
- 50Ω characteristic impedance
- No solder down
- Fill the gap between expensive spring pin solutions and unreliable elastomeric contact sets
Variable Height RF
- 35 GHz AC performance
- No solder down
- 8mm maximum stack height
- RF coaxial style (50 Ω)
- Removable/reusable
- Highly configurable
Aerospace
- Seamless transition and consistent performance from prototyping and EM stages to qualification and flight
- Eliminates concern of solder joint fatigue due to vibration, thermal cycling, and radiation
- Proven contact technology ensures reliability of socket through harshest ground, launch, and flight environments
- Optimized material usage for low outgassing, weight, and RF performance at Ka/Ku band, and integration with system level components
- Mixed pitch customization capability that can be utilized to maximize signal integrity of critical Tx/Rx signals
- Contact factory for product specifications and performance capabilities
Cryogenic
- Suitable for quantum computing, cryogenic, and high vacuum applications
- Maintains superior signal integrity characteristics even in special environment
- Custom material option for clean / bake-out, thermal grounding, CTE matching, etc.
- Consistent and low contact resistance
- Contact factory for product specifications and performance capabilities
High Node Count/Low Force
- 40 GHz AC performance
- RC Spring Probe pin technology
- No solder down
- Removable/reusable
- Highly configurable, any shape and size
- 10K+ node counts available
Ardent Contact Portfolio
Contact Factory
Ardent Contact Portfolio
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| Specifications | RC-04-04 RC Springprobeâ„¢ | RC05-01 RC Springprobeâ„¢ | RC08-02 RC Springprobeâ„¢ | RC10-07 RC Springprobeâ„¢ | RC10-04 RC Springprobeâ„¢ | RC12-06 RC Springprobeâ„¢ | CR08-062 RC Connect-Râ„¢ |
| Contact Material | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper |
| Mated Height (in/mm) | 0.030/0.76 | 0.030/0.76 | 0.045/1.14 | 0.055/1.40 | 0.085/2.16 | 0.90/2.29 | .062/1.57 |
| Minimum Pitch (in/mm) | 0.0157/0.40 | 0.0197/0.50 | 0.0315/0.80 | 0.0394/1.00 | 0.0394/1.00 | 0.0500/1.27 | 0.0315/0.80 |
| Compression Force / Contact (gram ± 20%) | 20 | 20 | 20 | 24 | 22 | 34 | 60 |
| Compression Range (in/mm) | 0.006/0.15 | 0.006/0.15 | 0.009/0.23 | 0.10/0.25 | 0.015/0.38 | 0.015/0.38 | 0.010/0.25 |
| Contact Resistance (mΩ) | 60 | 70 | 60 | 50 | 66 | 65 | 50 |
| Self-Inductance (nH) | ~.50 | 0.45 | 0.73 | 0.92 | 1.35 | ~1.50 | 0.61 |
| High Freq Capacity (-1 dB point, GHz) | ~20 | 25 | 20 | 37 | 11 | ~20 | 40 (@1mm Pitch) |
| Characteristics Impedance at Native Pitch (Ohms) | 56 | 65 | 61 | 73 | – | – | 57 (@1mm Pitch) |
| Durability (Cycles) | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 1,000 |
| Current Carrying Capacity (Single Contact at 30°C Temp Offset, Amps) | ~1 | ~1 | 1.8 | ~4 | 3.3 | 3.55 | ~2 |
| Approximate Insertion Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (-dB) | N/A | GSG: 0.25/0.55/2.15 | GSG: 0.15/1.0/2.75 | GSG: 0.25/0.55/2.35 | N/A | N/A | GSG: 0.15/0.35/0.9 |
| GSSG: 0.50/0.6/2.75 | GSSG: 1/1.5/2.5 | GSSG: 0.50/0.65/3.3 | GSSG: 0.85/1.6/1.35 | ||||
| Approximate Return Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (-dB) | N/A | GSG: 16/10/6 | GSG: 20/10/6 | GSG: 0.25/0.55/2.35 | N/A | N/A | GSG: 24/15/10 |
| GSSG: 14/13/5 | GSSG: 13/11/11 | GSSG: 0.50/0.65/3.3 | GSSG: 13/8/30 | ||||
| Approximate Insertion Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (dB) | N/A | GSG: 0.1/0.15/1.0 | GSG: 0.2/1.65/2.65 | GSG: 0.15/2.4/1.2 | N/A | N/A | N/A |
| GSSG: 0.2/0.55/1.2 | GSSG: 0.5/1/2.7 | GSSG: 0.25/2.4/1.2 | |||||
| Approximate Return Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (dB) | N/A | GSG: 30/17/7 | GSG: 17/8/15 | GSG: 12/5/7 | N/A | N/A | N/A |
| GSSG: 22/17/10 | GSSG: 17/10/8 | GSSG: 12/5/7 |
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