Ardent’s CA Series™ high performance 32 GHz+ compression mount connectors & interposers offer exceptional signal integrity and high density for applications like high-speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.
Reliable under extreme conditions, CA Series™ connectors can stand up to the most demanding environmental factors. Custom configurations are available in a wide array of pitch, density, stack height, and orientation.
Low-Profile Board-To-Board Compression Mount
- Quick-turn automation loaded connectors utilizing Connect-R contact technology ideal for high volume OEM applications
- Small volumes machined or large volumes molded
- 40 GHz AC performance in a highly configurable design (1-2500 leads)
- Custom and off-the-shelf connectors available
- Fill the gap between expensive spring pin solutions and unreliable elastomeric contact sets
- No solder down
Tight Pitch Board-To-Board Compression Mount
- 32 GHz+
- No solder down
- Area array pitches from 0.4 mm and up
- Removable/reusable
- Highly configurable, any shape and size
- Low compression force
Coaxial RF
- 35 GHz-70GHz AC performance
- Connect-R pin (35GHz) for high-volume, SpringProbe pin (70GHz+) for precision RF signal transmission
- 50Ω characteristic impedance
- No solder down
- Fill the gap between expensive spring pin solutions and unreliable elastomeric contact sets
Variable Height RF
- 35 GHz AC performance
- No solder down
- 8mm maximum stack height
- RF coaxial style (50 Ω)
- Removable/reusable
- Highly configurable
Aerospace
- Seamless transition and consistent performance from prototyping and EM stages to qualification and flight
- Eliminates concern of solder joint fatigue due to vibration, thermal cycling, and radiation
- Proven contact technology ensures reliability of socket through harshest ground, launch, and flight environments
- Optimized material usage for low outgassing, weight, and RF performance at Ka/Ku band, and integration with system level components
- Mixed pitch customization capability that can be utilized to maximize signal integrity of critical Tx/Rx signals
- Contact factory for product specifications and performance capabilities
Cryogenic
- Suitable for quantum computing, cryogenic, and high vacuum applications
- Maintains superior signal integrity characteristics even in special environment
- Custom material option for clean / bake-out, thermal grounding, CTE matching, etc.
- Consistent and low contact resistance
- Contact factory for product specifications and performance capabilities
High Node Count/Low Force
- 40 GHz AC performance
- RC Spring Probe pin technology
- No solder down
- Removable/reusable
- Highly configurable, any shape and size
- 10K+ node counts available
Ardent Contact Portfolio
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