Ardent Concepts’ TR Multicoax™ and SK™ Series connectors deliver exceptional performance for high-frequency and high-reliability applications tailored to the unique demands of the space and defense sectors. These products are engineered to support Ku/K/Ka-band frequencies and other critical RF and digital signals, providing robust solutions that ensure signal integrity under the most challenging conditions. Designed to withstand launch stresses and thermal cycling, the TR Multicoax™ and SK™ Series connectors meet stringent industry standards, making them ideal for both prototyping and full-scale production deployments in mission-critical environments. Ardent Concepts’ dedication to innovation ensures that each connector upholds the highest standards for durability, scalability, and performance required in the advanced aerospace and defense landscapes.
Challenges Facing Space & Defense Designers
Radio frequencies moving at record pace
Reliability/longevity concerns of solder joints of Ball Grid Array (BGA)/Column Grid Array (CGA) packages
Customization of commercial connectors often needed for SATCOM applications
Scalable solutions required as Low Earth Orbit and Constellation Satellite volumes increase

Our Core Values & IP

Signal Integrity
Ardent’s interconnect technology was born of a simple concept; What if we could eliminate the barrel and the plunger from a traditional “pogo” style spring pin and make the spring inside behave like an electrical contact instead of behaving like an inductor at multi-GHz speeds?
Solderless Electrical Interface
Our products are all based on solderless compression mount technology enabling more reliable and electrically repeatable performance over time and across programs. Our solderless compression products alleviate the concerns of solder fatigue and stress through launch and thermal cycling in defense and aerospace applications.
Signal Density
Contacts can be arranged in pitches down to 0.4mm (grid array) and 2.54mm signal-to-signal (coaxial array) to scale up the number of lanes in any system.
Mechanical Reliability
Mil-Spec qualified and rated for thousands of cycles in the harshest environments, Ardent’s patented technologies are production proven with over 19 years of field use for test and measurement and OEM interconnect.
Critical Design Considerations
Component Materials Selection:
• Large library of designs available for customization of signal integrity, environmental, and mechanical requirements.
• Lightweight solutions optimized for space applications.
PCB Launch Optimization:
• Tailored designs for microstrip, CPWG, and stripline routing.
Thermal Integration:
• Designed for compatibility with common space thermal management solutions.
Reliability and Qualification Proven Performance Through Industry-Standard Testing for:
• Vibration
• Thermal shock
• Salt fog
• Rated for over 1000 mating cycles.
• Custom qualification services using Finite Element Analysis (FEA) for design optimization.
• Third-party validated ruggedness and reliability

Manufacturing Excellence
