The newest form factors of Ardent’s TR Multicoax connectors support the many unique challenges of Quantum Computing applications. Density, substantial environmental changes, and an increasing need for more high-speed lanes are causing quantum computer designers to rethink traditional routing methods of individual cables.
Ardent’s existing patented contact technology allows engineers to drastically decrease real estate required by individual connectors and increase their channel count while improving signal integrity in their systems.
- 50Ω ganged hermetic feedthroughs offer leakproof design
- Variety of coaxial cable materials available (e.g. Flexible, CuNi, Non-Magnetic)
- Extremely dense form factor (168+ channels in standard ISO disc)
- Easily mate/de-mate multiple high-speed lanes
Precision Connections for Quantum Innovation
TR Multicoax™ Series
High-Density Coaxial Cabling for Control Electronics
- Connecting to interconnect at the Hermetic Feedthrough
- Customizable face plate footprint and cable assembly for minimized loss at 2.54mm pitch
- 047 Flexible Coax as standard, alternative materials available by request
- Form factors include 16, 24, and 32 channel
Hermetic Feedthrough (UD-HFT)
50Ω Sealed Hermetic Feedthroughs
- High density ganged atmospheric to Vacuum electrical feedthrough
- Connects TRH from Control/Readout electronics to Inner cryostat wiring
- Fully integrated into standard and customer specific vacuum flange designs
- Optional O-ring seal version available for modular customer installation
Cryogenic Wiring Solution (CWS)
Comprehensive, Easy-to-Install Wiring Solutions
- Inner cryostat wiring spans from 300 K down to 10 mK
- 034 Semi-Rigid Coax SCuNi as standard, alternative materials available by request
- TR Multicoax based all metal coaxial interface allows for noise floor crosstalk
- Form factors include 2.54mm pitch 16, 24, and 32 channel
TR Multicoax™ Attenuators
Cryogenic Attenuation
- Cryogenic and Vacuum compatible ganged attenuator
- NiCr thin film on Crystalline Quartz with OHFC housing
- Wide range of attenuation values available such as 0, 3, 6, 10, 15, & 20 dB
- TR Multicoax compatible form factors include 2.54mm pitch 16, 24, and 32 channel
TR Cryo™
High-Performance Coaxial Cabling for Quantum Processors
- Ganged TR Multicoax connections direct to QPU @ 2.54mm pitch
- Solderless system allows hot swapping of QPUs
- Available right-angle form factor gets closer to QPU
- Coaxial connector options available (SMA, SMP, and SMPM)
- Wide variety of flexible and formable cable options including Non-magnetic
SK Series™/CA Series™ Cryogenic Sockets and Interposers
Precision Test & Packaging Solutions for Quantum Processors
- High density Socket (SK) and Interposer (CA) assemblies down to 0.4mm and 0.5mm pitch
- Customizable solutions for any array or other requirements such as cryogenic thermal cycling, outgassing, non-magnetic materials, and CTE mismatch
- Core technology is placed within the interposer, sandwiching your device and breakout PCB with customizable size and material
Ardent Solutions
Signal Integrity
Ardent’s interconnect technology was born of a simple concept: What if we could eliminate the barrel and the plunger from a traditional “pogo” style spring pin and make the spring inside behave like an electrical contact instead of behaving like an inductor at multi-GHz speeds?
Solderless
Our products are all based on solderless compression mount technology enabling more reliable and electrically repeatable performance over time and across programs. Our solderless compression products allow our customers to be agile in changing their designs without having to scrap entire projects and printed circuit boards with components soldered to the board. This leads to enhanced flexibility and cost savings.
Density
Contacts can be arranged in pitches down to 0.4mm (grid array) and 2.54mm signal-to-signal (coaxial array) to scale up the number of lanes in any system.
Mechanical Reliability
Mil-Spec qualified and rated for thousands of cycles in the harshest environments, Ardent’s patented technologies are production proven with over 19 years of field use for test and measurement and OEM interconnect.
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| Specifications | RC-04-04 RC Springprobe™ | RC05-01 RC Springprobe™ | RC08-02 RC Springprobe™ | RC10-07 RC Springprobe™ | RC10-04 RC Springprobe™ | RC12-06 RC Springprobe™ | CR08-062 RC Connect-R™ |
| Contact Material | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper | Gold Plated Beryllium Copper |
| Mated Height (in/mm) | 0.030/0.76 | 0.030/0.76 | 0.045/1.14 | 0.055/1.40 | 0.085/2.16 | 0.90/2.29 | .062/1.57 |
| Minimum Pitch (in/mm) | 0.0157/0.40 | 0.0197/0.50 | 0.0315/0.80 | 0.0394/1.00 | 0.0394/1.00 | 0.0500/1.27 | 0.0315/0.80 |
| Compression Force / Contact (gram ± 20%) | 20 | 20 | 20 | 24 | 22 | 34 | 60 |
| Compression Range (in/mm) | 0.006/0.15 | 0.006/0.15 | 0.009/0.23 | 0.10/0.25 | 0.015/0.38 | 0.015/0.38 | 0.010/0.25 |
| Contact Resistance (mΩ) | 60 | 70 | 60 | 50 | 66 | 65 | 50 |
| Self-Inductance (nH) | ~.50 | 0.45 | 0.73 | 0.92 | 1.35 | ~1.50 | 0.61 |
| High Freq Capacity (-1 dB point, GHz) | ~20 | 25 | 20 | 37 | 11 | ~20 | 40 (@1mm Pitch) |
| Characteristics Impedance at Native Pitch (Ohms) | 56 | 65 | 61 | 73 | – | – | 57 (@1mm Pitch) |
| Durability (Cycles) | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 1,000 |
| Current Carrying Capacity (Single Contact at 30°C Temp Offset, Amps) | ~1 | ~1 | 1.8 | ~4 | 3.3 | 3.55 | ~2 |
| Approximate Insertion Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (-dB) | N/A | GSG: 0.25/0.55/2.15 | GSG: 0.15/1.0/2.75 | GSG: 0.25/0.55/2.35 | N/A | N/A | GSG: 0.15/0.35/0.9 |
| GSSG: 0.50/0.6/2.75 | GSSG: 1/1.5/2.5 | GSSG: 0.50/0.65/3.3 | GSSG: 0.85/1.6/1.35 | ||||
| Approximate Return Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (-dB) | N/A | GSG: 16/10/6 | GSG: 20/10/6 | GSG: 0.25/0.55/2.35 | N/A | N/A | GSG: 24/15/10 |
| GSSG: 14/13/5 | GSSG: 13/11/11 | GSSG: 0.50/0.65/3.3 | GSSG: 13/8/30 | ||||
| Approximate Insertion Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (dB) | N/A | GSG: 0.1/0.15/1.0 | GSG: 0.2/1.65/2.65 | GSG: 0.15/2.4/1.2 | N/A | N/A | N/A |
| GSSG: 0.2/0.55/1.2 | GSSG: 0.5/1/2.7 | GSSG: 0.25/2.4/1.2 | |||||
| Approximate Return Loss at Native Pitch W/O Contact Element at 10/20/40 GHz (dB) | N/A | GSG: 30/17/7 | GSG: 17/8/15 | GSG: 12/5/7 | N/A | N/A | N/A |
| GSSG: 22/17/10 | GSSG: 17/10/8 | GSSG: 12/5/7 |
- Scalable solutions for connectors down to 0.4mm pitch
- Eliminates the barrel and the plunger from a traditional “pogo” style spring pin (fewer mechanical components to fail)
- Patented “wipe action” of the coils causes contacts to behave like a solid element instead of behaving like an inductor, resulting in exceptionally clean AC performance in an extremely short electrical path
| Specification | Value |
|---|---|
| Pitch | 0.4mm and above |
| Frequency | Up to 40 GHz in array configuration, Up to 90 GHz in coaxial configuration |
| See Contact Portfolio tab for details. | |
- Cost-effective automation loaded contacts
- High performance
- Stamped contact for area array applications down to 0.6mm pitch
| Specification | Value |
|---|---|
| Pitch | 0.8mm and above |
| Frequency | Up to 40 GHz |
| See Contact Portfolio tab for details. | |
Description
The TR Multicoax is a compression mount, multi-port cable assembly for carrying high speed signals. With true 70 GHz performance, TR is the highest performing solderless connector solution on the market today.
Compared to traditional solder down coaxial connectors like SMAs and SMPs, TR Multicoax takes up 80% less space and is easily re-usable as it can be moved from position to position without the need for any surface mount components.
Applications
- Near-QPU
- Dilution Refrigerator/Cryostat
- Room Temperature Electronics
- Vacuum Chambers
| Feature | Benefit |
|---|---|
| Fully coaxial, solderless compliant interface | Ultra-low crosstalk contribution from connector |
| No costly PCB solder-down leave behinds required | |
| 2.54mm pitch signal-to-signal | Dense footprint allows for exponential real estate saving |
| Multiple cable and connector options | Opposite the TR Multicoax interface, industry standard (SMA, 2.92mm, SMP) connectors make system integration and connection to room-temp electronics seamless |
| Internal coaxial cabling options include: low outgassing flexible, semi-rigid, non-magnetic | |
| Assemblies available in a variety of form factors, channel counts, cable lengths, and pre-bent configurations | Easily scale up existing known-good designs |
- Using patented spring probe technology, the TR Multicoax combines the Ardent Interposer technology and coaxial cable technology to create an unsurpassed solderless connector solution
- By carefully controlling the geometry and material properties, the Ardent Interposer technology minimizes impedance discontinuities in an extremely electrically short transition enabling 70 GHz + performance
Inner-Fridge Wiring
Thermal Anchoring
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Description
50Ω Hermetic Feedthrough is ideal for applications where hermeticity is crucial to the transmission of RF signals. In these applications, TR Multicoax connectors are mated to the hermetic feedthrough on either end ensuring an impedance matched 50Ω channel between any two chambers. The feedthrough is fixed to a flange (such as an ISO disk) with screws in blind holes from the inside of the vacuum. Each channel on the hermetic feedthrough is completely sealed using an epoxy potting.
Applications
- Dilution Refrigerators/Cryogenic Devices
- Quanum Computing
- Vacuum Chambers
- Defense/Aerospace
| Feature | Benefit |
|---|---|
| Leak-proof Design | Max leak rate 4 x 10^-9 mbar*L/s |
| Extremely dense form factor | See individual flanges below for details |
| TR Multicoax assembly mates with just a few captive screws | Quick connection of multiple high-speed lanes |
| Robust Interface | Ensures no signal degradation up to 1000 mates/de-mates |
TR Multicoax 50Ω Hermetic Feedthrough: 168 RF Lanes 
SMA 50Ω Hermetic Feedthrough: 27 RF Lanes 
| Specification | Value | |
|---|---|---|
| ELECTRICAL | ||
| Parameters | Qualified at 20 GHz; stable characteristics out to 40 GHz | |
| Return Loss | ≤ -12 dB to 20 GHz | |
| Insertion Loss | ≤ -1 dB to 20 GHz | |
| Impedance | 50Ω ±5Ω, measured at 50 picosecond rise time | |
| MECHANICAL | ||
| Form Factors | 16 and 24 channel versions available | |
| Mating Life | Rated for 1000 mechanical cycles | |
| Pitch | 2.54mm/4.00mm pitch signal to signal | |
| MATERIAL | ||
| Victrex Peek 450G | ||
| 303 Stainless Steel with gold over nickel plate | ||
| BeCu Alloy 172 with gold over nickel plate | ||
| ENVIRONMENTAL | ||
| Leak-proof Rate | Max leak rate 4 x 10^-9 mbar*L/s | |
| Parameters | Qualified at room temperature (contact Ardent Concepts for operation at other temperature ranges) | |
| TOOLING | ||
| Tooling Information | 4 mounting holes in ISO flange or bulkhead required for feedthrough mounting. Feedthrough provides mounting and tooling for TR connector to attach to the feedthrough | |
Description
High density thermalized low noise cryogenic bulkhead attenuator array for use with TR Multicoax™ connectors. Utilizes industry leading materials like Oxygen-free high thermal conductivity (OFHC) copper and NiCr on thermally conductive crystalline quartz dielectric provides minimal change in attenuation with temperature delta. Attenuation is offered in 0, 10, and 20 dB configurations and supports bandwidth up to 12 GHz. 16 channel form factor at a 2.54 mm pitch, signal to signal, saves valuable real estate in confined spaces.
Applications
- Dilution Refrigerators/Cryogenic Devices
- Quanum Computing
- Vacuum Chambers
- Defense/Aerospace
| Feature | Benefit |
|---|---|
| 16 Integrated Attenuators | Small form factor for space constrained environments |
| Frequency: DC to 12 GHz | Idea for Quantum Computing applications |
| 0, 10, and 20 dB models | Multiple attenuation values available for experimentation |
| Ardent Concepts TR compatible | Substantial channel increase over traditional surface mount connectors |
| Machined OFHC block, gold plated | Minimal change in attenuation with temperature |
| NiCR on thermally conductive crystaline quartz dielectric | |
| Non-superconducting microstrip attenuator pad | |
| Silver Epoxy bonded |
Contact Factory for Full Drawing
NOTE:
For Attenuator Block interfacing, the TR Multicoax connector must include shorter dowels and mounting screws.
Please be sure to note the requirement to mate with an Attenuator in your quote requests
| ELECTRICAL | Specification | Value |
|---|---|---|
| Attenuation Values | 0, 10, 20 dB – Consult factory for additional values | |
| Data Rates | DC to 12 GHz | |
| Attenuation @ 5 GHz | ± 1 dB * | |
| Insertion Loss Variation with Frequency | < 1 dB * | |
| Return Loss | -10 dB for 0 dB | |
| MECHANICAL | ||
| Max Power Handling | 100 mW | |
| Mates With | TR Multicoax™ Connectors | |
| # Of Channels | 16×2 (standard) – Consult factory for addional values | |
| Pitch | 2.54mm – Consult factory for additional values | |
| Mounting | Attenuators mounted with screws to thermal (or similar) plate | |
| Temperature Rating | Validated to 3mK (samples in vacuum) | |
| * At room temperature | ||
-10 dB Crystalline Quartz Substrate SN 1087
-20 dB Crystalline Quartz Substrate SN 1092
Description
Ardent’s high-density, solderless TR Multicoax and interposer technology, allows engineers launch a large amount of RF or digital signals in a small area, while being able to place connectors in unparalleled proximity to the device under test.
Light-tight form factors (with provisions to panel mount into a thermally conductive flange, disk, or other mounting plate) and all metal sockets and interposers available for chip-to-board and board-to-board connections are available.
Applications
- Dilution Refrigerators/Cryogenic Devices
- Quanum Computing
- Vacuum Chambers
- Defense/Aerospace
- Panel mount TR = feedthrough to light-tight enclosure
- Blind-Mate another TR to reach samples within enclosure
- Heat dissipation from the thermal anchor to the coax center conductor
- TR density allows higher # of coax lines
- 160 lines – 55mm x 85mm
- Fewer screws than SMA/SMP = faster install and reconfiguration
- High-density connectors bring coax lines closer to sample
- More signals + shorter trace
- Right angle FF for low clearance areas
- Light-tight enclosure
- Shielding cans
- Solderless connection
- Stable
- Reliable
- Reconfigurable
- Solderless connection substrate → sample
- No wire bonds
- No indium bumps
- Save components between revisions
- ≥ 0.4mm pin pitch (square grid)
- 1,000+ pins per CA
- DC – 30 GHz signal frequency
- Low outgassing materials
Contact Factory
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