Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series

We invite you to attend our webinar: “Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series Connectors.” Discover how the latest advancements in interposer technology are revolutionizing quantum computing. We will discuss the benefits provided by true solderless connectivity, eliminating wire bonds and indium bumps, and enabling high-density pin configurations. Driven by our ongoing commitment to exceptional signal integrity, Amphenol Ardent Concepts offers cutting-edge materials and design optimizations that support functional compatibility with cryogenic conditions. Explore the potential for customized solutions tailored to meet the specific needs of your quantum computing application.

Key Takeaways:

• Solderless Connectivity & Component Conservation: Simplifies assembly and enables the reuse of components, reducing costs and waste.
• Material Advancements: Utilizes advanced, low-outgassing, and cryogenically suitable materials to enhance performance and reliability.
• Optimized Contact Properties & Customization: Our low-resistance contacts deliver excellent signal integrity across a range of applications and we offer flexible design solutions tailored to suit your needs. Custom plating options are available for environments sensitive to magnetism.