Who should attend this webinar?
- Space & Defense designers facing these (and similar) challenges:
- Radio frequencies moving at record pace
- Reliability/longevity concerns of solder joints of Ball Grid Array (BGA) / Column Grid Array (CGA) packages
- Customization of commercial connectors often needed for SATCOM applicationsFinding the right radiation hardening (Rad-hard) FPGA for designs
- Scalable solutions required as Low Earth Orbit and Constellation Satellite volumes increase
Key takeaways:
- Ardent’s Mil-Spec qualified electrical contact / interface technology ensures reliability of socket through harshest ground, launch, and flight environments
- Advanced customization of contact pattern for both RF and digital signaling maximizes signal integrity of critical Tx / Rx RF signaling (e.g. coaxial and grid array in the same interposer)
- Our prototype machined and production-ready hard tooled design options allow for a seamless transition from test / ground-based systems to HVM production flight applications
