Integrating TR Cryo™ Multicoax and the CWS™ Platform into a compact tabletop cryogenic system for next-generation quantum research.

HAMPTON, N.H. and BILLINGS, Mont. – Amphenol Ardent Concepts, a leader in high-performance cryogenic interconnect technologies, and Four9 Design, an innovator in advanced cryogenic systems, today announced a collaboration to integrate Ardent’s TR Cryo™ Multicoax technology as part of its CWS™ Platform into Four9 Design’s Q-DEV™ tabletop cryogenic platform.

As cryogenic experimentation, driven by emerging technologies like quantum computing, continues to advance, researchers require increasing numbers of RF and DC connections to support larger quantum devices, more sophisticated control electronics, and increasingly complex experiments. At the same time, development teams need compact, accessible cryogenic platforms that enable rapid prototyping without the footprint, complexity, or operating costs associated with large production-scale dilution refrigerators.

By combining Four9 Design’s compact Q-DEV™ platform with Ardent’s CWS™ Platform, featuring TR Cryo™ Multicoax technology, the two companies are delivering an integrated cryogenic development solution that provides high-density connectivity in a benchtop environment, enabling faster device characterization, packaging evaluation, and quantum hardware development.

The collaboration combines Four9 Design’s expertise in compact, low-vibration cryogenic platforms with Ardent’s modular cryogenic interconnect architecture. TR Cryo™ Multicoax provides high-density microwave connectivity with exceptional electrical performance throughout the cryogenic environment, while the CWS™ Platform integrates RF and DC wiring, superconducting cable assemblies, hermetic feedthroughs, thermalization, and modular interconnect technologies into a scalable cryogenic infrastructure that grows alongside evolving quantum systems.

“Quantum computing is advancing at an incredible pace, and we’re seeing researchers require more RF and DC connections earlier in the development cycle than ever before,” said Nat Stevens, Director of Marketing, Amphenol Ardent Concepts. “The combination of our TR Cryo™ Multicoax technology and CWS™ Platform with Four9 Design’s compact Q-DEV system brings high-density, modular cryogenic interconnect technology into an accessible tabletop platform. Together, we’re enabling researchers to prototype faster, iterate with greater flexibility, and build on an interconnect architecture that can scale alongside their quantum programs.”

Unlike large dilution refrigerators designed to support complete quantum computing systems, the integrated Four9 Design and Ardent solution is optimized for rapid development cycles. Researchers can evaluate devices, iterate packaging concepts, validate cryogenic interconnect strategies, and characterize next-generation quantum hardware on a compact tabletop platform while leveraging the same modular interconnect architecture that can transition into larger cryogenic infrastructures as programs mature.

Accelerating Quantum Development

High-Density Connectivity in a Compact Footprint

As quantum devices continue to demand increasing RF and DC line counts, Ardent’s TR Cryo™ Multicoax technology enables dense microwave connectivity while the CWS™ Platform provides a modular architecture that efficiently integrates those connections within the compact Q-DEV™ system.

Faster Development Cycles

A pre-integrated cryogenic platform and interconnect architecture reduces engineering effort and risk, shortens installation time, and allows researchers to focus on advancing quantum devices rather than integrating cryogenic hardware.

High-Throughput, Automated Screening

Q-DEV™ is built for volume. Automated cooldown, warmup, and measurement sequencing through Four9 Design’s integrated control system allows teams to run device screening campaigns unattended and overnight, while unobstructed all-sides access to the cryogenic workspace keeps sample exchange a routine operation rather than a scheduled event. Combined with the line count enabled by TR Cryo™ Multicoax, a single Q-DEV system can screen a full batch of devices in the time previously required to prepare one for measurement.

A Modular Platform Built for Innovation

The CWS™ Platform is engineered around a comprehensive, serviceable, modular wiring architecture that simplifies upgrades, maintenance, and configuration changes, allowing researchers to adapt their systems as experimental requirements evolve.

Optimized Electrical and Thermal Performance

Leveraging superconducting wiring options, engineered thermalization strategies, hermetic transitions, and the high-frequency performance of TR Cryo™ Multicoax, the integrated solution delivers excellent signal integrity and repeatability through thermal cycles while minimizing thermal loading throughout the cryogenic environment.

A Seamless Path to Future Quantum Systems

The technologies integrated into the CWS™ Platform are designed to support customers throughout the evolution of their quantum programs. Researchers can develop and validate packaging, wiring, and interconnect strategies on a compact tabletop platform before transitioning to higher-channel-count cryogenic infrastructures, reducing development risk while accelerating system deployment.

“At Four9 Design, our mission is to simplify cryogenic experimentation and accelerate quantum innovation,” said Caleb Schreibeis, President and Chief Engineer “Integrating Ardent’s CWS™ Platform into Q-DEV gives our customers access to a scalable cryogenic interconnect architecture that complements our compact system while supporting the industry’s continued move toward higher line counts and increasingly capable quantum hardware.”

The collaboration reflects both companies’ shared commitment to advancing quantum computing by delivering integrated cryogenic infrastructure that reduces development complexity without compromising performance. Together, Ardent Concepts and Four9 Design are helping researchers accelerate the path from early-stage innovation to scalable quantum systems.

About Amphenol Ardent Concepts

Amphenol Ardent Concepts develops high-performance interconnect technologies for demanding applications spanning quantum computing, cryogenics, semiconductor test, aerospace, and high-speed communications. The company’s CWS™ Platform is a modular cryogenic interconnect architecture integrating TR Cryo™ Multicoax, superconducting cable assemblies, hermetic feedthroughs, thermalization technologies, and precision interconnect solutions designed for reliable operation in extreme environments.

About Four9 Design

Four9 Design develops robust, high-performance cryogenic systems that fully optimize cooling, vacuum, and vibration performance in a robust and easy to use platform for quantum research and advanced scientific applications. The Q-DEV™ platform is purpose-built for high-throughput quantum device screening, offering unobstructed all-sides access to the experiment, highly flexible RF and DC I/O configuration, and automated, unattended measurement campaigns that qualify devices and packages before they enter larger cryogenic systems. Learn more at four9design.com.