Join us for a free 30 minute introduction to our CA Series where you will learn the key features and benefits of the highest density, high speed, connectors and interposers on the market!
Key Takeaways from this Webinar:
- Learn about the benefits of high speed high density connectors and the variety of scalable form factors Amphenol Ardent offers
- Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings
- How our CA Series connectors and interposers offer superior signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.
