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DTSTART;TZID=America/New_York:20260505T130000
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DTSTAMP:20260614T110934
CREATED:20260427T170333Z
LAST-MODIFIED:20260427T185122Z
UID:10000740-1777986000-1777987800@ardentconcepts.com
SUMMARY:Enabling Reliable Electrical Characterization for 224G & 448G Optical Systems
DESCRIPTION:As systems move to 224G and early 448G signaling\, validating high-speed channels is becoming less about the device itself and more about how you access it. \nEven in optical architectures\, engineers still rely on electrical characterization during bring-up\, compliance\, and debug. But at these data rates\, the measurement interface can distort results\, limit bandwidth\, and introduce variability that masks true system performance.\nThis creates a critical challenge: how do you maintain accurate\, repeatable electrical access without the test fixture becoming the weakest link? \nIn this webinar\, we’ll walk through where traditional test approaches begin to break down and how solderless compression-mounted interfaces enable cleaner\, more repeatable measurement paths. We’ll focus on practical implementation across real development workflows\, from early device evaluation through system-level validation. \nKey Takeaways: \n\nUnderstand why measurement interfaces become a primary source of error at 224G and beyond\nIdentify where electrical access is still required in optical system development workflows\nLearn how fixture-induced loss\, discontinuities\, and variability impact real measurements\nSee how compression-mounted test access improves repeatability across boards\, modules\, and system validation\n\nPlease register using the link in the Details section below.
URL:https://ardentconcepts.com/event/enabling-reliable-electrical-characterization-for-224g-448g-optical-systems/
LOCATION:Webinar
ATTACH;FMTTYPE=image/png:https://ardentconcepts.com/wp-content/webpc-passthru.php?src=https://ardentconcepts.com/wp-content/uploads/2024/07/AACTR90RA8x125403WF_2_blue-background_small_REV2.png&amp;nocache=1
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DTSTART;TZID=America/New_York:20260519T130000
DTEND;TZID=America/New_York:20260519T133000
DTSTAMP:20260614T110934
CREATED:20260514T200810Z
LAST-MODIFIED:20260514T200810Z
UID:10000741-1779195600-1779197400@ardentconcepts.com
SUMMARY:Enabling Scalable Backplane Connector Testing for 224G & 448G Datacenter Systems
DESCRIPTION:As datacenter systems move to 224G and early 448G signaling\, validating backplane connector performance is becoming increasingly critical both in design\, as well as in rack deployment. \nHigh-speed backplane connectors still require reliable electrical characterization during development\, validation\, production test\, and system-level debug. However\, at these data rates\, the test hardware becomes critical. Legacy interconnects\, longer PCB breakouts\, and repeated mating cycles can distort measurements\, consume already-tight loss budgets\, and make it harder to separate true connector performance from test setup variability. \nThis creates a critical challenge: how do you maintain accurate\, repeatable electrical access to all high-density backplane channels? \nIn this webinar\, we’ll walk through where traditional backplane connector test approaches begin to break down as lane speeds and I/O density increase. We’ll also look at how solderless compression-mounted interfaces can support cleaner\, more repeatable measurement paths for all testing types. The discussion will focus on practical implementation across real datacenter workflows\, from early connector characterization through channel compliance\, automated test\, and post-installation debug. \nKey Takeaways: \n• Understand why backplane connector characterization becomes more difficult at 224G and early 448G data rates.\n• Identify how legacy interconnects\, breakout distance\, mating cycles\, and fixture-induced loss can impact real measurements.\n• Learn where repeatable electrical access is required across development\, validation\, production test\, and system-level debug.\n• See how high-density\, solderless compression-mounted test access can help reduce trace length\, improve repeatability\, and support cleaner characterization of backplane channels.\n• Explore how TR Multicoax™ interfaces support scalable backplane connector validation across bench\, production\, and in-situ diagnostic workflows. \nPlease register using the link in the Details section below.
URL:https://ardentconcepts.com/event/enabling-scalable-backplane-connector-testing-for-224g-448g-datacenter-systems/
LOCATION:Webinar
ATTACH;FMTTYPE=image/jpeg:https://ardentconcepts.com/wp-content/webpc-passthru.php?src=https://ardentconcepts.com/wp-content/uploads/2026/05/TR70-Mounted-Cropped-jpeg.jpg&amp;nocache=1
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