Ardent Concepts

Introduction to CA Series Connectors and Interposers Webinar
2026-01-29 11:00 - 11:30, 2026-02-26 11:00 - 11:30, 2026-03-26 11:00 - 11:30, 2026-04-23 11:00 - 11:30, 2026-05-21 11:00 - 11:30, 2026-06-18 11:00 - 11:30, 2026-07-16 11:00 - 11:30 (America/New_York) | Webinar
Join us for a free 30 minute introduction to our CA Series where you will learn the key features and benefits of the highest density, high speed, connectors and interposers on the market!
Key Takeaways from this Webinar:

Learn about the benefits of high speed high density connectors and the variety of scalable form factors Amphenol Ardent offers
Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings
How our CA Series connectors and interposers offer superior signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.

Introduction to TR Multicoax Series Webinar
2026-02-05 11:00 - 11:30, 2026-02-19 11:00 - 11:30, 2026-03-05 11:00 - 11:30, 2026-03-19 11:00 - 11:30, 2026-04-02 11:00 - 11:30, 2026-04-16 11:00 - 11:30, 2026-04-30 11:00 - 11:30, 2026-05-14 11:00 - 11:30 and 6 more dates
Join us for a free 30 minute introduction to our TR Multicoax Series where you will learn the key features and benefits of the highest density, high speed, multicoax connector on the market!
Key Takeaways from this Webinar:
• Learn about the benefits of high speed high density connectors that come in a variety of form factors
• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings
• Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements

Introduction to SK Series Sockets Webinar
2026-02-12 11:00 - 11:30, 2026-03-12 11:00 - 11:30, 2026-04-09 11:00 - 11:30, 2026-05-07 11:00 - 11:30, 2026-06-04 11:00 - 11:30, 2026-07-02 11:00 - 11:30, 2026-07-30 11:00 - 11:30
Join us for a free 30 minute introduction to Ardent Concepts’ SK Family of Sockets. This webinar will cover some of the most important benefits of using Ardent Concepts’ unique SK Family of test socket solutions when designing and developing next generation electronics.
Who should attend:
Engineers looking to characterize and test high speed RF and digital transmission lines with the industry-leading performance of the Ardent SK Socket series solutions.
Preface:
Engineers involved in the design, testing, and manufacturing of high speed devices are generally focused on sockets that offer high performance at a reasonable cost. Learn how Ardent’s patented solderless contact technology, which utilizes industry-leading alloys, makes for a cost-effective and electrically robust socket solution!
Key Benefits:
By attending the webinar you will:
• Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket
• See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology
• Learn about how our sockets can save you time and money throughout the design and test process

Enabling Reliable Electrical Characterization for 224G & 448G Optical Systems
2026-05-05 13:00 - 13:30
As systems move to 224G and early 448G signaling, validating high-speed channels is becoming less about the device itself and more about how you access it.
Even in optical architectures, engineers still rely on electrical characterization during bring-up, compliance, and debug. But at these data rates, the measurement interface can distort results, limit bandwidth, and introduce variability that masks true system performance.
This creates a critical challenge: how do you maintain accurate, repeatable electrical access without the test fixture becoming the weakest link?
In this webinar, we’ll walk through where traditional test approaches begin to break down and how solderless compression-mounted interfaces enable cleaner, more repeatable measurement paths. We’ll focus on practical implementation across real development workflows, from early device evaluation through system-level validation.
Key Takeaways:

Understand why measurement interfaces become a primary source of error at 224G and beyond
Identify where electrical access is still required in optical system development workflows
Learn how fixture-induced loss, discontinuities, and variability impact real measurements
See how compression-mounted test access improves repeatability across boards, modules, and system validation

Please register using the link in the Details section below.

Enabling Scalable Backplane Connector Testing for 224G & 448G Datacenter Systems
2026-05-19 13:00 - 13:30
As datacenter systems move to 224G and early 448G signaling, validating backplane connector performance is becoming increasingly critical both in design, as well as in rack deployment.
High-speed backplane connectors still require reliable electrical characterization during development, validation, production test, and system-level debug. However, at these data rates, the test hardware becomes critical. Legacy interconnects, longer PCB breakouts, and repeated mating cycles can distort measurements, consume already-tight loss budgets, and make it harder to separate true connector performance from test setup variability.
This creates a critical challenge: how do you maintain accurate, repeatable electrical access to all high-density backplane channels?
In this webinar, we’ll walk through where traditional backplane connector test approaches begin to break down as lane speeds and I/O density increase. We’ll also look at how solderless compression-mounted interfaces can support cleaner, more repeatable measurement paths for all testing types. The discussion will focus on practical implementation across real datacenter workflows, from early connector characterization through channel compliance, automated test, and post-installation debug.
Key Takeaways:
• Understand why backplane connector characterization becomes more difficult at 224G and early 448G data rates.
• Identify how legacy interconnects, breakout distance, mating cycles, and fixture-induced loss can impact real measurements.
• Learn where repeatable electrical access is required across development, validation, production test, and system-level debug.
• See how high-density, solderless compression-mounted test access can help reduce trace length, improve repeatability, and support cleaner characterization of backplane channels.
• Explore how TR Multicoax™ interfaces support scalable backplane connector validation across bench, production, and in-situ diagnostic workflows.
Please register using the link in the Details section below.
