Ardent Concepts

TR CRYO™: Revolutionizing Quantum and Cold Computing Connections
2024-06-11 13:00 - 13:30 (America/New_York) | Webinar
Join us for an educational webinar: “TR CRYO: Revolutionizing Quantum and Cold Computing Connections.” This webinar focuses on how Amphenol Ardent Concepts’ cutting-edge TR CRYO Multicoax™ connector is a driving force in the pursuit of improved standards in signal integrity and vacuum and cryogenic compatibility while boasting maximum density and flexibility for a range of cryostats and quantum applications. Learn about the innovative, solderless compression mount design that facilitates modular scalability and quick adaptation in rapidly-evolving experimental setups and how Ardent Concepts is solving the challenges of thermal contraction in ultra-low temperature environments.
Key Takeaways:

Superior Performance in Extreme Environments: The TR Cryo Multicoax Series offers exceptional signal integrity, vacuum, and cryogenic compatibility. Its all-metal interconnect system ensures robust performance from cryogenic temperatures to room temperature, making it ideal for Quantum Computing and Cold Computing applications.
Modular and Scalable Design: Featuring a solderless compression mount design, the TR Cryo connectors allow for quick and seamless adaptation to changing experimental setups. This modularity supports maximum density and flexibility, catering to various cryostats and Quantum Architectures while reducing downtime between setups.
Enhanced System Integration: With a dense footprint and multiple coaxial cabling options (including low outgassing flexible, semi-rigid, and non-magnetic cables), the TR Cryo connectors facilitate seamless integration into existing systems. The all-metal, fully coaxial solderless interface eliminates PCB solder-down leave behinds, enhancing noise floor crosstalk and enabling exponential scaling of RF lines.

Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series
2024-06-06 13:00 - 13:30 | Webinar
We invite you to attend our webinar: “Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series Connectors.” Discover how the latest advancements in interposer technology are revolutionizing quantum computing. We will discuss the benefits provided by true solderless connectivity, eliminating wire bonds and indium bumps, and enabling high-density pin configurations. Driven by our ongoing commitment to exceptional signal integrity, Amphenol Ardent Concepts offers cutting-edge materials and design optimizations that support functional compatibility with cryogenic conditions. Explore the potential for customized solutions tailored to meet the specific needs of your quantum computing application.
Key Takeaways:

Solderless Connectivity & Component Conservation: Simplifies assembly and enables the reuse of components, reducing costs and waste.
Material Advancements: Utilizes advanced, low-outgassing, and cryogenically suitable materials to enhance performance and reliability.
Optimized Contact Properties & Customization: Our low-resistance contacts deliver excellent signal integrity across a range of applications and we offer flexible design solutions tailored to suit your needs. Custom plating options are available for environments sensitive to magnetism.

Introduction to TR Multicoax Series Webinar
2024-06-06 11:00 - 11:30, 2024-05-23 11:00 - 11:30, 2024-05-09 11:00 - 11:30, 2024-04-25 11:00 - 11:30, 2024-04-11 11:00 - 11:30, 2024-03-28 11:00 - 11:30, 2024-03-14 11:00 - 11:30, 2024-02-29 11:00 - 11:30 and 5 more dates | Webinar
Join us for a free 30 minute introduction to our TR Multicoax Series where you will learn the key features and benefits of the highest density, high speed, multicoax connector on the market!
Key Takeaways from this Webinar:

Learn about the benefits of high speed high density connectors that come in a variety of form factors.
Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings.
Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements.

Introduction to SK Series Sockets Webinar
2024-05-30 11:00 - 11:30, 2024-05-02 11:00 - 11:30, 2024-04-04 11:00 - 11:30, 2024-03-07 11:00 - 11:30, 2024-02-08 11:00 - 11:30, 2024-01-11 11:00 - 11:30, 2023-12-14 11:00 - 11:30, 2023-12-14 08:00 - 17:00 | Webinar
Join us for a free 30 minute introduction to Ardent Concepts’ SK Family of Sockets. This webinar will cover some of the most important benefits of using Ardent Concepts’ unique SK Family of test socket solutions when designing and developing next generation electronics.
Who should attend:
Engineers looking to characterize and test high speed RF and digital transmission lines with the industry-leading performance of the Ardent SK Socket series solutions.
Preface:
Engineers involved in the design, testing, and manufacturing of high speed devices are generally focused on sockets that offer high performance at a reasonable cost. Learn how Ardent’s patented solderless contact technology, which utilizes industry-leading alloys, makes for a cost-effective and electrically robust socket solution!
Key Benefits:
By attending the webinar you will:

Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket
See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology
Learn about how our sockets can save you time and money throughout the design and test process

Connected Cold: Mastering Cryogenic Challenges with Advanced Thermal Compensation in Ganged RF Coaxial Cable Assemblies
2024-03-28 13:00 - 13:30, 2023-12-21 13:00 - 13:30 | Webinar
Key Takeaways
1. Quantum-Ready Stability:
– TR Cryo (TRC) ensures stable signal integrity in quantum systems at near absolute zero, with its innovative design.
2. Thermal Contraction Innovation:
– TRC addresses thermal contraction without compromising performance, proving reliable connections in extreme cryogenic conditions.
3. Dependable Quantum Scaling:
– TRC plays a vital role in the quantum industry’s evolution, providing dependable connections for scaling systems with increased qubit counts and RF lines demand.

OFC 2024
2024-03-26 - 2024-03-28
OFC, the premier global event for optical communications and networking professionals, attracts attendees from around the world to a conference and exhibition that showcases the latest industry advancements and emerging technologies.

APS March Meeting 2024
2024-03-05 - 2024-03-07
Amphenol Ardent Concepts will be in Booth #1001
The American Physical Society’s March Meeting 2024 is a scientific research conference convening 13,000 physicists and students from around the world to connect and collaborate across academia, industry, and major labs. Join us in 2024 for an extra special week as we celebrate the 125th anniversary of APS.
Join us in Minneapolis for the in-person experience on March 5-7!

DesignCon 2024
2024-01-31 - 2024-02-02
Visit us in Amphenol’s Booth #833
Register today for three days of education, exhibits, and networking! We look forward to seeing you in-person soon. You can find Amphenol Ardent Concepts in Booth #833 to learn more about our high-speed test and measurement solutions.

Modularity in RF Systems: An Overview of the O-Ring 50Ω Hermetic Feedthrough
2023-12-12 13:00 - 13:30 | Webinar
Explore the transformative potential of the O-Ring 50Ω Hermetic Feedthrough (oHFT) in our upcoming webinar focusing on applications where hermeticity is crucial to high-speed signal transmission. Amphenol Ardent Concepts is inviting you to attend a brief 30 minute webinar reviewing the many features and benefits provided by our oHFT.
Key Takeaways:
• Leak-Proof Reliability: Amphenol Ardent Concepts’ oHFT’s leak-proof design boasts an impressive max leak rate and a field replaceable o-ring for unparalleled reliability.
• Spatial Efficiency: HFT is available in extremely dense form factors, capable of accommodating 160+ channels in a standard ISO 100 flange, optimizing spatial efficiency for diverse applications.
• Scalable Design, Excellent Signal Integrity: Learn about the quick, simple integration between our feedthrough and TR Multicoax connectors and the impact our innovative design has on signal integrity in transitions from atmospheric to vacuum environments

Unlocking High-Density RF Systems: Introducing The Ultra Density 50Ω Hermetic Feedthrough
2023-12-07 13:00 - 13:30 | Webinar
Learn about the Ultra Density 50Ω Hermetic Feedthrough (UD-HFT) in this brief webinar. With its direct-to-flange design, ability to fit 300+ channels in an ISO 100 flange, and simple integration with our TR Multicoax connectors, Amphenol Ardent Concepts’ UD-HFT is an ideal solution for scaling and optimizing RF signaling.
Key Takeaways:
• Leak-Proof Reliability: UD-HFT ensures a leak-proof design for dependable performance
• Ultra-Dense Form Factor: Its direct-to-flange design accommodates an impressive 300+ channels in a standard ISO 100 flange, optimizing space.
• Efficient Connectivity: TR Multicoax assembly enables quick and secure connections, backed by a robust interface ensuring signal integrity over 1000 mates/de-mates.
