Maximizing Value with Multi-Purpose Test Vehicles for High-Frequency Testing
2025-05-15 13:00 - 14:00 (America/New_York)
Join us for an in-depth look at how multi-purpose test vehicles can maximize signal integrity and mechanical performance for high-frequency testing. As data rates push into the 224G and 448G realm, traditional fixture designs are no longer enough. Learn how Amphenol’s TR Multicoax solutions enable superior signal breakout, minimize loss, and simplify testing without the need for soldered connections. Whether you’re tackling component/IP development, post-silicon validation, or production testing, this webinar will show you how to future-proof your test strategies with cutting-edge interconnect technology.
Key Takeaways:

Reduce PCB losses and improve test performance by utilizing solderless ganged coaxial connectors, enabling closer breakout to the device under test.
Simplify complex high-frequency testing with modular, field-replaceable TR Multicoax interfaces that eliminate the need for reflow soldering.
Future-proof your designs for 224G+ development with scalable solutions optimized for higher bandwidth, reduced footprint, and superior mechanical durability.

Please register using the link in the “Details” section:

Introduction to TR Multicoax Series Webinar
2025-05-22 11:00 - 11:30, 2025-06-05 11:00 - 11:30, 2025-06-19 11:00 - 11:30, 2025-07-03 11:00 - 11:30, 2025-07-17 11:00 - 11:30, 2025-07-31 11:00 - 11:30, 2025-08-14 11:00 - 11:30, 2025-08-28 11:00 - 11:30 and 8 more dates | Webinar
Join us for a free 30 minute introduction to our TR Multicoax Series where you will learn the key features and benefits of the highest density, high speed, multicoax connector on the market!
Key Takeaways from this Webinar:

Learn about the benefits of high speed high density connectors that come in a variety of form factors.
Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings.
Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements.

Introduction to SK Series Sockets Webinar
2025-05-29 11:00 - 11:30, 2025-06-26 11:00 - 11:30, 2025-07-24 11:00 - 11:30, 2025-08-21 11:00 - 11:30, 2025-09-18 11:00 - 11:30, 2025-10-16 11:00 - 11:30, 2025-11-13 11:00 - 11:30, 2025-12-11 11:00 - 11:30 | Webinar
Join us for a free 30 minute introduction to Ardent Concepts’ SK Family of Sockets. This webinar will cover some of the most important benefits of using Ardent Concepts’ unique SK Family of test socket solutions when designing and developing next generation electronics.
Who should attend:
Engineers looking to characterize and test high speed RF and digital transmission lines with the industry-leading performance of the Ardent SK Socket series solutions.
Preface:
Engineers involved in the design, testing, and manufacturing of high speed devices are generally focused on sockets that offer high performance at a reasonable cost. Learn how Ardent’s patented solderless contact technology, which utilizes industry-leading alloys, makes for a cost-effective and electrically robust socket solution!
Key Benefits:
By attending the webinar you will:

Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket
See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology
Learn about how our sockets can save you time and money throughout the design and test process

Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series
2025-07-01 13:00 - 13:30 | Webinar
We invite you to attend our webinar: “Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series Connectors.” Discover how the latest advancements in interposer technology are revolutionizing quantum computing. We will discuss the benefits provided by true solderless connectivity, eliminating wire bonds and indium bumps, and enabling high-density pin configurations. Driven by our ongoing commitment to exceptional signal integrity, Amphenol Ardent Concepts offers cutting-edge materials and design optimizations that support functional compatibility with cryogenic conditions. Explore the potential for customized solutions tailored to meet the specific needs of your quantum computing application.
Key Takeaways:

Solderless Connectivity & Component Conservation: Simplifies assembly and enables the reuse of components, reducing costs and waste.
Material Advancements: Utilizes advanced, low-outgassing, and cryogenically suitable materials to enhance performance and reliability.
Optimized Contact Properties & Customization: Our low-resistance contacts deliver excellent signal integrity across a range of applications and we offer flexible design solutions tailored to suit your needs. Custom plating options are available for environments sensitive to magnetism.

Please register using the link in the Details section below:

Modularity in RF Systems: An Overview of the O-Ring 50Ω Hermetic Feedthrough
2025-07-22 11:00 - 11:30 | Webinar
Explore the transformative potential of the O-Ring 50Ω Hermetic Feedthrough (oHFT) in our upcoming webinar focusing on applications where hermeticity is crucial to high-speed signal transmission. Amphenol Ardent Concepts is inviting you to attend a brief 30 minute webinar reviewing the many features and benefits provided by our oHFT.
Key Takeaways:
• Leak-Proof Reliability: Amphenol Ardent Concepts’ oHFT’s leak-proof design boasts an impressive max leak rate and a field replaceable O-ring for unparalleled reliability.
• Spatial Efficiency: HFT is available in extremely dense form factors, capable of accommodating 160+ channels in a standard ISO 100 flange, optimizing spatial efficiency for diverse applications.
• Scalable Design, Excellent Signal Integrity: Learn about the quick, simple integration between our feedthrough and TR Multicoax connectors and the impact our innovative design has on signal integrity in transitions from atmospheric to vacuum environments.
Please register using the link in the Details section below:

Unlocking High-Density RF Systems: Introducing The Ultra Density 50Ω Hermetic Feedthrough
2025-07-22 13:00 - 13:30 | Webinar
Learn about the Ultra Density 50Ω Hermetic Feedthrough (UD-HFT) in this brief webinar. With its direct-to-flange design, ability to fit 300+ channels in an ISO 100 flange, and simple integration with our TR Multicoax connectors, Amphenol Ardent Concepts’ UD-HFT is an ideal solution for scaling and optimizing RF signaling.
Key Takeaways:
• Leak-Proof Reliability: UD-HFT ensures a leak-proof design for dependable performance
• Ultra-Dense Form Factor: Its direct-to-flange design accommodates an impressive 300+ channels in a standard ISO 100 flange, optimizing space.
• Efficient Connectivity: TR Multicoax assembly enables quick and secure connections, backed by a robust interface ensuring signal integrity over 1000 mates/de-mates.
Please register using the link in the Details section below:

Cryogenic Wiring Solutions (CWS): Enhancing Performance in Dilution Refrigeration Systems
2025-07-31 13:00 - 13:30 | Webinar
Join us for an in-depth webinar as Amphenol Ardent Concepts addresses the challenges presented by advanced quantum computing and cryogenic applications: “Cryogenic Wiring Solutions (CWS): Enhancing Performance in Dilution Refrigeration Systems.” Attendees of this webinar will learn how CWS integrates multiple components into a single, comprehensive system designed for easy installation and optimized performance in cryogenic environments. Discover the advanced functionality of CWS, including its ability to facilitate high-fidelity signal transmissions and operate effectively at extremely low temperatures. Our collaborative approach ensures we meet the unique design specifications of each customer, and we offer a comprehensive testing and project plan to ensure high-quality integration into systems.
Key Takeaways:

Comprehensive Integration: CWS offers a complete solution with seamless installation and integration with Dilution Refrigerators, reducing setup complexity and time.
High-Fidelity Signal Transmission: Ensures reliable signal integrity and low thermal conductivity, crucial for quantum computing research, regardless of the type of transmission line used.
Customizable and Collaborative Design: Tailored to specific customer requirements through a collaborative partnership, ensuring the system fits perfectly with individual needs.

Please register using the link in the Details section below:
