Ardent Concepts

Maximizing Value with Multi-Purpose Test Vehicles for High-Frequency Testing
2025-05-15 13:00 - 14:00 (America/New_York)
Join us for an in-depth look at how multi-purpose test vehicles can maximize signal integrity and mechanical performance for high-frequency testing. As data rates push into the 224G and 448G realm, traditional fixture designs are no longer enough. Learn how Amphenol’s TR Multicoax solutions enable superior signal breakout, minimize loss, and simplify testing without the need for soldered connections. Whether you’re tackling component/IP development, post-silicon validation, or production testing, this webinar will show you how to future-proof your test strategies with cutting-edge interconnect technology.
Key Takeaways:

Reduce PCB losses and improve test performance by utilizing solderless ganged coaxial connectors, enabling closer breakout to the device under test.
Simplify complex high-frequency testing with modular, field-replaceable TR Multicoax interfaces that eliminate the need for reflow soldering.
Future-proof your designs for 224G+ development with scalable solutions optimized for higher bandwidth, reduced footprint, and superior mechanical durability.

Please register using the link in the “Details” section:

Introduction to TR Multicoax Series Webinar
2025-05-08 11:00 - 11:30, 2025-04-24 11:00 - 11:30, 2025-04-10 11:00 - 11:30, 2025-03-27 11:00 - 11:30, 2025-03-13 11:00 - 11:30, 2025-02-27 11:00 - 11:30, 2025-02-13 11:00 - 11:30, 2025-01-30 11:00 - 11:30 and 10 more dates | Webinar
Join us for a free 30 minute introduction to our TR Multicoax Series where you will learn the key features and benefits of the highest density, high speed, multicoax connector on the market!
Key Takeaways from this Webinar:

Learn about the benefits of high speed high density connectors that come in a variety of form factors.
Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings.
Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements.

Introduction to SK Series Sockets Webinar
2025-05-01 11:00 - 11:30, 2025-04-03 11:00 - 11:30, 2025-03-06 11:00 - 11:30, 2025-02-06 11:00 - 11:30, 2025-01-09 11:00 - 11:30, 2024-12-12 11:00 - 11:30, 2024-11-14 11:00 - 11:30, 2024-10-17 11:00 - 11:30 and 1 more date | Webinar
Join us for a free 30 minute introduction to Ardent Concepts’ SK Family of Sockets. This webinar will cover some of the most important benefits of using Ardent Concepts’ unique SK Family of test socket solutions when designing and developing next generation electronics.
Who should attend:
Engineers looking to characterize and test high speed RF and digital transmission lines with the industry-leading performance of the Ardent SK Socket series solutions.
Preface:
Engineers involved in the design, testing, and manufacturing of high speed devices are generally focused on sockets that offer high performance at a reasonable cost. Learn how Ardent’s patented solderless contact technology, which utilizes industry-leading alloys, makes for a cost-effective and electrically robust socket solution!
Key Benefits:
By attending the webinar you will:

Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket
See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology
Learn about how our sockets can save you time and money throughout the design and test process

TR Multicoax™ Navigating the Shift to Ku / K / Ka Band Signaling in Space and Defense Applications
2024-12-12 13:00 - 13:30
Join us for an insightful webinar as we delve into the dynamic world of space and defense radio frequencies. As data throughputs and commercial demands continue to soar, the need for increased bandwidth has led to a shift towards Ku/K/Ka band signaling, operating within the 12-40 GHz range.
However, this transition provides a set of challenges that we will explore in depth. One critical aspect is the shielding of RF Tx/Rx signals, which is crucial to ensure signal integrity and prevent interference. We will also examine the potential risks to the reliability and longevity of solder joints in traditional surface-mount technology (SMT) connectors and how the extreme conditions experienced during launch and thermal cycling put these solder joints at risk, highlighting the
importance of robust design and engineering practices.
Amphenol Ardent Concepts’ TR Multicoax™ Series is an ideal solution to these and other challenges. Available in a variety of frequencies and form factors, our solderless, compression mount test connectors are designed to provide excellent and consistent results in the harshest environments while mitigating the risk of mechanical failure throughout launch and thermal cycling.
Key Takeaways:
• The shift toward Ku/K/Ka band signaling (12-40 GHz) presents challenges beyond the capabilities of traditional, commercial connectors
• Reliability/longevity of solder joints for traditional SMT connectors are at-risk through launch and thermal cycling
• Ardent’s TR Multicoax™ Series high-density connectors are designed to provide reliable results in the harshest environments

Flight-Ready Ku/K/Ka-Band Socket Solutions for Space & Defense
2024-11-21 13:00 - 13:35
Who should attend this webinar?

Space & Defense designers facing these (and similar) challenges:
Radio frequencies moving at record pace​
Reliability/longevity concerns of solder joints of Ball Grid Array (BGA) / Column Grid Array (CGA) packages ​
Customization of commercial connectors often needed for SATCOM applications​Finding the right radiation hardening (Rad-hard) FPGA for designs​
Scalable solutions required as Low Earth Orbit and Constellation Satellite volumes increase​

Key takeaways:

Ardent’s Mil-Spec qualified electrical contact / interface technology ensures reliability of socket through harshest ground, launch, and flight environments
Advanced customization of contact pattern for both RF and digital signaling maximizes signal integrity of critical Tx / Rx RF signaling (e.g. coaxial and grid array in the same interposer)
Our prototype machined and production-ready hard tooled design options allow for a seamless transition from test / ground-based systems to HVM production flight applications
